About this scholarly article

Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Improvement of nickel wire bonding using Al nano coating by Klengel, Robert; Klengel, Sandy; Schischka, Jan; Lorenz, Georg; Petzold, Matthias is a scholarly article available to read on EtoBox.

Author

Klengel, Robert; Klengel, Sandy; Schischka, Jan; Lorenz, Georg; Petzold, Matthias

Publisher

IEEE

Published

2014