About this scholarly article

2009 International Conference on Electronic Packaging Technology & High Density Packaging - AL/NI multilayer used as a local heat source for mounting microelectronic components by Zhang, Jun; Wu, Feng-shun; Zou, Jian; An, Bing; Liu, Hui is a scholarly article available to read on EtoBox.

Author

Zhang, Jun; Wu, Feng-shun; Zou, Jian; An, Bing; Liu, Hui

Publisher

IEEE

Published

2009

Language

EN