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About this Materials Science article
New Solid-state Die-attach Method Using Silver Foil Bonded on Aluminum Substrate by Eutectic Reaction by Fu, Shao-Wei; Lee, Chin C. is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Fu, Shao-Wei; Lee, Chin C.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0925-8388)
- Published
- 2019
- Field
- Materials Science (Physical Sciences)