About this scholarly article

SPIE Proceedings [SPIE Asia Pacific Symposium on Microelectronics and MEMS - Gold Coast, Australia (Wednesday 27 October 1999)] Design, Characterization, and Packaging for MEMS and Microelectronics - Novel design of a MEMS-based tactile sensor by Singh, Ranjit; Courtois, Bernard; Demidenko, Serge N. is a scholarly article available to read on EtoBox.

Author

Singh, Ranjit; Courtois, Bernard; Demidenko, Serge N.

Publisher

SPIE

Published

1999