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About this Engineering article
Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing by Ye, Hua; Basaran, Cemal; Hopkins, Douglas is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Ye, Hua; Basaran, Cemal; Hopkins, Douglas
- Publisher
- American Institute of Physics; AIP Publishing (ISSN 0003-6951)
- Published
- 2003
- Language
- EN
- Field
- Engineering (Physical Sciences)
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