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About this Engineering article

Using Thermal-Aware VM Migration Mechanism for High-Availability Cloud Computing by Chen, Ying-Jun ;Horng, Gwo-Jiun ;Li, Jian-Hua ;Cheng, Sheng-Tzong is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Chen, Ying-Jun ;Horng, Gwo-Jiun ;Li, Jian-Hua ;Cheng, Sheng-Tzong
Publisher
Springer US; Springer-Verlag; Kluwer Academic Publishers; Springer Science and Business Media LLC; Publons; Society for Mining, Metallurgy and Exploration Inc. (ISSN 0929-6212)
Published
2017
Field
Engineering (Physical Sciences)

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