About this scholarly article

Improvement of package warpage through substrate and EMC optimization by Lee, Ken ;Kim, Min Sung ;Kim, Jaesung ;Kim, Sangkyun ;Lee, Donghwan ;Jung, Kyunghag is a scholarly article available to read on EtoBox.

Author

Lee, Ken ;Kim, Min Sung ;Kim, Jaesung ;Kim, Sangkyun ;Lee, Donghwan ;Jung, Kyunghag

Publisher

IEEE

Published

2018