About this scholarly article

2006 International Conference on Electronic Materials and Packaging - Analysis of SMT Residues after Reflow by Chaoyun, Luo; Sang, Liu; Cui, Zhang; Hongchun, Zhang; Jifan, Wang; Xin, Zhong is a scholarly article available to read on EtoBox.

Author

Chaoyun, Luo; Sang, Liu; Cui, Zhang; Hongchun, Zhang; Jifan, Wang; Xin, Zhong

Publisher

IEEE

Published

2006

Language

EN