About this scholarly article

Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B - Silicon Interposer Featuring Novel Electrical and Optical TSVs by Thadesar, Paragkumar A.; Bakir, Muhannad S. is a scholarly article available to read on EtoBox.

Author

Thadesar, Paragkumar A.; Bakir, Muhannad S.

Publisher

American Society of Mechanical Engineers

Published

2012

Language

EN