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Esec 2009 fSE: Fastest Die Bonder by jerry is a document available to read on EtoBox.

What is Esec 2009 fSE: Fastest Die Bonder about?

The Esec 2009 fSE Die Bonder is the fastest soft solder die bonder in the industry, capable of throughputs of 2,500 to 8,000 units per hour depending on configuration. It features a point-to-line pick and place system for increased throughput of matrix leadframes. The bonder can handle a wide variety of packages and leadframe sizes, and optional conversion kits provide flexibility for changes in product mix. Compared to competitors, the Esec 2009 fSE uses up to 50% less gas, resulting in significant operati

Author

jerry

Language

EN