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About this Engineering article
High Heat Flux Cooling for Silicon Hybrid Multichip Packaging by Jaeger, R.C.; Goodling, J.S.; Baginski, M.E.; Ellis, C.D.; Williamson, N.V.; O'Barr, R.M. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Jaeger, R.C.; Goodling, J.S.; Baginski, M.E.; Ellis, C.D.; Williamson, N.V.; O'Barr, R.M.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0148-6411)
- Published
- 1989
- Field
- Engineering (Physical Sciences)