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What is Heterogeneous Integration on 2.3D Substrate about?

This study investigates the heterogeneous integration of two chips on a 2.3D hybrid substrate using solder joints and underfill, focusing on design, materials, and reliability. The hybrid substrate features a fine metal L/S RDL-substrate and a build-up package substrate, with detailed fabrication processes and drop test results provided. The research highlights the challenges of yield loss in hybrid substrates and presents a comprehensive approach to improve integration and reliability in microelectronics p

Author

Average Joe

Language

EN