About this scholarly article

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) - MCM-D/C packaging solution for IBM latest S/390 servers by Perfecto, E.D.; Shields, R.R.; Jeanneret, M.P.; Malhotra, A.K.; McHerron, D.C. is a scholarly article available to read on EtoBox.

Author

Perfecto, E.D.; Shields, R.R.; Jeanneret, M.P.; Malhotra, A.K.; McHerron, D.C.

Publisher

IMAPS - Int. Microelectron. & Packaging Soc

Published

1999

Language

EN