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About this Engineering article
Automated wire bonding versus tape automated bonding: What are the tradeoffs? : Subash Khadpe. Proc. IEEE 28th Electron. Components Conf., Anaheim, 24–26 April 1978, p. 402 is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 1978
- Field
- Engineering (Physical Sciences)