About this scholarly article

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - QFN reliability, thermal shock, lead-free vs. SnPb, microstructure by Anselm, Martin K.; Ghaffarian, Reza is a scholarly article available to read on EtoBox.

Author

Anselm, Martin K.; Ghaffarian, Reza

Publisher

IEEE

Published

2017