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About this Engineering article
Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging by Liu, Xiangdong (author);Nishikawa, Hiroshi (author) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Liu, Xiangdong (author);Nishikawa, Hiroshi (author)
- Publisher
- Elsevier Ltd
- Published
- 2016
- Field
- Engineering (Physical Sciences)
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