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This study investigates the morphologies and nucleus models of β-Sn grains in Sn-3.0Ag-0.5Cu-xIn (SAC305-xIn) solder balls and joints, revealing that In addition significantly refines β-Sn grains. Seven distinct β-Sn grain morphologies were identified, with cyclic twinning structures established to explain their formation. The research highlights the relationship between In content and β-Sn grain morphology, contributing to understanding the reliability of Sn-based solder joints.

Author

sardar4056

Language

EN