About this scholarly article

International Workshop on System Level Interconnect Prediction - Impact of nano-scale through-silicon vias on the quality of today and future 3D IC designs by Kim, Dae Hyun; Kim, Suyoun; Lim, Sung Kyu is a scholarly article available to read on EtoBox.

Author

Kim, Dae Hyun; Kim, Suyoun; Lim, Sung Kyu

Publisher

IEEE

Published

2011

Language

EN