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About this Engineering article
Effects of Grain Size and Abrasive Size of Polycrystalline Nano-particle Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing by Kang, Hyun-Goo; Katoh, Takeo; Kim, Sung-Jun; Paik, Ungyu; Park, Hyung-Soon; Park, Jea-Gun is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Kang, Hyun-Goo; Katoh, Takeo; Kim, Sung-Jun; Paik, Ungyu; Park, Hyung-Soon; Park, Jea-Gun
- Publisher
- Institute of Pure and Applied Physics; Japan Society of Applied Physics; IOP Publishing (ISSN 0021-4922)
- Published
- 2004
- Language
- EN
- Field
- Engineering (Physical Sciences)