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Effects of Grain Size and Abrasive Size of Polycrystalline Nano-particle Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing by Kang, Hyun-Goo; Katoh, Takeo; Kim, Sung-Jun; Paik, Ungyu; Park, Hyung-Soon; Park, Jea-Gun is a Engineering article available to read on EtoBox.

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Author
Kang, Hyun-Goo; Katoh, Takeo; Kim, Sung-Jun; Paik, Ungyu; Park, Hyung-Soon; Park, Jea-Gun
Publisher
Institute of Pure and Applied Physics; Japan Society of Applied Physics; IOP Publishing (ISSN 0021-4922)
Published
2004
Language
EN
Field
Engineering (Physical Sciences)