About this scholarly article

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Study on mold flow during compression molding for embedded wafer level package (EMWLP) with multiple chips by Sorono, D. V.; Ji Lin, ; Chai Tai Chong, ; Ser Choong Chong, ; Vempati, S. R. is a scholarly article available to read on EtoBox.

Author

Sorono, D. V.; Ji Lin, ; Chai Tai Chong, ; Ser Choong Chong, ; Vempati, S. R.

Publisher

IEEE

Published

2012