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About this Engineering article
Adhesive Bond Imaging by Noncontact Measurements With Single-Sided Access by Nakao, Shogo; Hayashi, Takahiro is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Nakao, Shogo; Hayashi, Takahiro
- Publisher
- The American Society of Mechanical Engineers(ASME) (ISSN 2572-3901)
- Published
- 2018
- Language
- EN
- Field
- Engineering (Physical Sciences)