About this document
IO Pad Design and ESD Protection by Surendra Lovely Surendra is a document available to read on EtoBox.
Pads interface the chip to the outside world and protect against electrostatic discharge (ESD). They provide openings for bonding wires and include ESD protection structures to dissipate high voltages from ESD and prevent gate oxide breakdown. Different pad types exist for various functions like power, analog/digital input/output, and biasing. Pads are a critical part of chip design and require careful consideration of ESD protection and drive requirements.
- Author
- Surendra Lovely Surendra
- Language
- EN