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About this Engineering article
Ultrasonic Analysis of the Degree of Cure and Cohesive Properties of the Adhesive in a Bond Joint by Maeva, E. Y.; Severina, I.; Chapman, G. B. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Maeva, E. Y.; Severina, I.; Chapman, G. B.
- Publisher
- Springer; Informa UK (Taylor & Francis); Taylor & Francis; Informa UK Limited (ISSN 0934-9847)
- Published
- 2007
- Field
- Engineering (Physical Sciences)