About this scholarly article

2016 International Conference on Electronics Packaging (ICEP) - Novel copper surface preparation processes for copper alloy lead frame lamination pretreatment in embedded packaging device by Chen, Wei-Chung; Lee, Chiu-Wen; Lin, Lu-Fu; Liu, Yen-Fu; Cheng, Hau; Hsu, Te-Jung; Tsai, Kun-Ting; Chen, Ming-Hung; Chen, Tang-Yuan; Yang, Pin-Feng; Uegaki, Shoji; Hung, Chih-Pin is a scholarly article available to read on EtoBox.

Author

Chen, Wei-Chung; Lee, Chiu-Wen; Lin, Lu-Fu; Liu, Yen-Fu; Cheng, Hau; Hsu, Te-Jung; Tsai, Kun-Ting; Chen, Ming-Hung; Chen, Tang-Yuan; Yang, Pin-Feng; Uegaki, Shoji; Hung, Chih-Pin

Publisher

IEEE

Published

2016

Language

EN