About this scholarly article

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Analysis of LED wire bonding process using arbitrary Lagrangian-Eulerian and equilibrium mesh smoothing algorithm by Yang, Che-Chia; Tsai, Chia-Chi; Su, Yen-Fu; Chiang, Kuo-Ning is a scholarly article available to read on EtoBox.

Author

Yang, Che-Chia; Tsai, Chia-Chi; Su, Yen-Fu; Chiang, Kuo-Ning

Publisher

IEEE

Published

2015

Language

EN