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This document provides information about Dicing-Grinding Service (DGS) which offers various wafer processing services including dicing, grinding, and polishing. Some key capabilities and technologies mentioned include thickness measurement, die strength testing, automatic optical inspection, and an online customer tracking system. DGS is certified to ISO and OHSAS standards and operates from a new cleanroom facility in Germany, offering services for a variety of materials up to 300mm wafer sizes.

Author

agniva datta

Language

EN