Can I read Influence of Interfacial Intermetallic Compound on Fracture Behavior of Solder Joints on EtoBox?

Influence of Interfacial Intermetallic Compound on Fracture Behavior of Solder Joints by Hwa-Teng Lee; Ming-Hung Chen; Huei-Mei Jao; Tain-Long Liao is a Engineering article available to read on EtoBox.

What is Influence of Interfacial Intermetallic Compound on Fracture Behavior of Solder Joints about?

This paper studies the solder joints of an Sn Á/Ag lead-free solder system with pure copper wires. The study focuses upon the interrelationships, which exist between the adhesive strength of the joint, its shear strength, the formation of interfacial intermetallic compounds (IMC) and the fractographic morphology. Additionally, the paper determines how these characteristics, and the relationships between them, are influenced by the storage duration and the storage temperature. Experimental results show that both the adhesive strength and the shear strength of the solder joints decrease significantly following short-term thermal storage. As the storage time is increased, it is noted that both the thickness and the roughness of the interfacial IMC layers increase. Regarding the fracture of the solder joints, fractographic observation reveals that fracture morphology under adhesive loading are similar to those observed under shear loading conditions. In the as-soldered condition, the fracture surface appears to be flat, and some broken Cu 6 Sn 5 and residual solder pieces are evident. When the total thickness of the IMC layer lies within the range 1 Á/10 mm, it is observed that the fra

Who reads Influence of Interfacial Intermetallic Compound on Fracture Behavior of Solder Joints?

Author

Hwa-Teng Lee; Ming-Hung Chen; Huei-Mei Jao; Tain-Long Liao

Publisher

Elsevier Science; Elsevier ; Elsevier BV (ISSN 0921-5093)

Published

2003

Language

EN

Field

Engineering (Physical Sciences)