About this scholarly article
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Temperature effects on electromigration behavior of solder joints by Ke, Jia-Hong; Kao, C. Robert is a scholarly article available to read on EtoBox.
- Author
- Ke, Jia-Hong; Kao, C. Robert
- Publisher
- IEEE
- Published
- 2010
- Language
- EN