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What is 14nm FinFET Monolithic 3D IC Design about?

This paper discusses the design and evaluation of a 14nm Finfet based Transistor-Level Monolithic 3D IC (TR-L M3D) technology, which addresses challenges faced by conventional 2D CMOS at sub-22nm nodes. The TR-L M3D technology demonstrates significant benefits over 2D CMOS, including a 55% reduced footprint, 25% shorter wire length, and 18% lower power consumption through innovative design techniques such as cell folding and efficient RC extraction methodologies. The findings indicate that TR-L M3D not only

Author

ndmthi

Language

EN