About this scholarly article

2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Investigation on the Interface Thermal Resistance of Copper-Titanium by Xu, Yixin; Zhu, Fulong; Wang, Miaocao; Lu, Zilin; Hu, Jianxiong; Zeng, Pengjun is a scholarly article available to read on EtoBox.

Author

Xu, Yixin; Zhu, Fulong; Wang, Miaocao; Lu, Zilin; Hu, Jianxiong; Zeng, Pengjun

Publisher

IEEE

Published

2019