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A Back-Wafer Contacted Silicon-On-Glass Integrated Bipolar Process—Part I: The Conflict Electrical Versus Thermal Isolation by Nanver, L.K.; Nenadovic, N.; d'Alessandro, V.; Schellevis, H.; van Zeijl, H.W.; Dekker, R.; de Mooij, D.B.; Zieren, V.; Slotboom, J.W. is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Nanver, L.K.; Nenadovic, N.; d'Alessandro, V.; Schellevis, H.; van Zeijl, H.W.; Dekker, R.; de Mooij, D.B.; Zieren, V.; Slotboom, J.W.
Publisher
IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0018-9383)
Published
2004
Field
Engineering (Physical Sciences)

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Browse all works by Nanver, L.K.; Nenadovic, N.; d'Alessandro, V.; Schellevis, H.; van Zeijl, H.W.; Dekker, R.; de Mooij, D.B.; Zieren, V.; Slotboom, J.W.