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About this Engineering article
Stencil printing of solder paste for fine-pitch surface mount assembly : John R. Morris and Thaddeus Wojcik. IEEE Trans. Compon. Hybrids mfg Technol. 14(3), 560 (1991) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 1992
- Field
- Engineering (Physical Sciences)