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This research article presents a kinetic model that describes the dependence of thin film stress on growth rate, temperature, and microstructure. The model explains the evolution of stress during thin film deposition, highlighting the competition between stress generation and relaxation mechanisms at the triple junction. It provides insights into how steady-state stress varies with parameters such as grain size and growth rate, and it aims to extend atomistic models for broader applicability in understandin

Author
20enph03
Language
EN