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About this Engineering article
Development of a dynamic constitutive model with particle damage and thermal softening for Al/SiCp composites by Sun, Wei; Duan, Chunzheng; Yin, Wendian is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Sun, Wei; Duan, Chunzheng; Yin, Wendian
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0263-8223)
- Published
- 2020
- Language
- EN
- Field
- Engineering (Physical Sciences)