About this scholarly article

2006 International Conference on Electronic Materials and Packaging - Investigation of the Effect of PCB Base Materials and Pad Surface Finish on the Thermal Fatigue Life of Lead-free Solder Joints of PBGA and Passive Resistors by Song, Fubin; Lee, S. W. Ricky; Osterman, Michael; Pecht, Michael is a scholarly article available to read on EtoBox.

Author

Song, Fubin; Lee, S. W. Ricky; Osterman, Michael; Pecht, Michael

Publisher

IEEE

Published

2006

Language

EN