Opening book details…
About this Engineering article
Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C by Huang, Chia-Wei; Lin, Kwang-Lung is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Huang, Chia-Wei; Lin, Kwang-Lung
- Publisher
- Cambridge University Press; Cambridge University Press (Materials Research Society); Cambridge University Press (CUP); Research Square (ISSN 0884-2914)
- Published
- 2004
- Language
- EN
- Field
- Engineering (Physical Sciences)