About this scholarly article

Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Reliability of carbon nanotube bumps for chip on glass application by Fan, Xiaogang; Li, Xiaolei; Mu, Wei; Jiang, Di; Huang, Shirong; Fu, Yifeng; Zhang, Yan; Liu, Johan is a scholarly article available to read on EtoBox.

Author

Fan, Xiaogang; Li, Xiaolei; Mu, Wei; Jiang, Di; Huang, Shirong; Fu, Yifeng; Zhang, Yan; Liu, Johan

Publisher

IEEE

Published

2014