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About this Engineering article
Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process by Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0261-3069)
- Published
- 2015
- Language
- EN
- Field
- Engineering (Physical Sciences)
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