About this scholarly article

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Ultra low cost wafer level via filling and interconnection using conductive polymer by Saint-Patrice, D.; Jacquet, F.; Bridoux, C.; Bolis, S.; Anciant, R.; Pouydebasque, A.; Sillon, N.; Vigier-Blanc, E. is a scholarly article available to read on EtoBox.

Author

Saint-Patrice, D.; Jacquet, F.; Bridoux, C.; Bolis, S.; Anciant, R.; Pouydebasque, A.; Sillon, N.; Vigier-Blanc, E.

Publisher

IEEE

Published

2011