About this scholarly article

SPIE Proceedings [SPIE Advanced Lithography - San Jose, CA (Sunday 24 February 2008)] Design for Manufacturability through Design-Process Integration II - Continuous process window modeling for process variation aware OPC and lithography verification by Zhang, Qiaolin; Yan, Qiliang; Zhang, Yunqiang; Lucas, Kevin; Singh, Vivek K.; Rieger, Michael L. is a scholarly article available to read on EtoBox.

Author

Zhang, Qiaolin; Yan, Qiliang; Zhang, Yunqiang; Lucas, Kevin; Singh, Vivek K.; Rieger, Michael L.

Publisher

SPIE

Published

2008

Language

EN