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First Production of New Thin 3D Sensors for HL-LHC at FBK by Sultan, DMS; Betta, Gian-Franco Dalla; Mendicino, Roberto; Boscardin, Maurizio; Ronchin, Sabina; Zorzi, Nicola is a scholarly article available to read on EtoBox.

What is First Production of New Thin 3D Sensors for HL-LHC at FBK about?

Owing to their intrinsic (geometry dependent) radiation hardness, 3D pixel sensors are promising candidates for the innermost tracking layers of the forthcoming experiment upgrades at the Phase 2 High-Luminosity LHC (HL-LHC). To this purpose, extreme radiation hardness up to the expected maximum fluence of 2e16 neq.cm-2 must come along with several technological improvements in a new generation of 3D pixels, i.e., increased pixel granularity (50x50 or 25x100 um2 cell size), thinner active region (~100 um), narrower columnar electrodes (~5 um diameter) with reduced inter-electrode spacing (~30 um), and very slim edges (~100 um). The fabrication of the first batch of these new 3D sensors was recently completed at FBK on Si-Si direct wafer bonded 6-inch substrates. Initial electrical test results, performed at wafer level on sensors and test structures, highlighted very promising performance, in good agreement with TCAD simulations: low leakage current (<1 pA/column), intrinsic breakdown voltage of more than 150 V, capacitance of about 50 fF/column, thus assessing the validity of the design approach. A large variety of pixel sensors compatible with both existing (e.g., ATLAS FEI4 and

Author

Sultan, DMS; Betta, Gian-Franco Dalla; Mendicino, Roberto; Boscardin, Maurizio; Ronchin, Sabina; Zorzi, Nicola

Published

2016

Language

EN