About this scholarly article

IEEE MTT-S International Microwave Symposium Digest, 2005. - Experimental evaluation of an active envelope load pull architecture for high speed device characterization by Williams, T.; Benedikt, J.; Tasker, P.J. is a scholarly article available to read on EtoBox.

Author

Williams, T.; Benedikt, J.; Tasker, P.J.

Publisher

IEEE

Published

2005

Language

EN