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About this Engineering article
The development of repairable Au-Al solid phase diffusion flip-chip bonding by Iida, A.; Kizaki, Y.; Fukuda, Y.; Mori, M. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Iida, A.; Kizaki, Y.; Fukuda, Y.; Mori, M.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1083-4400)
- Published
- 1997
- Field
- Engineering (Physical Sciences)
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