About this scholarly article

2007 9th Electronics Packaging Technology Conference - FTIR Method to Distinguish Mold Compound Types and Identify the Presence of Post-Mold-Cure (PMC) Treatment on Electronic Packaging by Ng, Yan-Shan; Hooi, Wan-Keong is a scholarly article available to read on EtoBox.

Author

Ng, Yan-Shan; Hooi, Wan-Keong

Publisher

IEEE

Published

2007

Language

EN