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A Near-infrared Colloidal Quantum Dot Imager with Monolithically Integrated Readout Circuitry by Jing Liu; Peilin Liu; Dengyang Chen; Tailong Shi; Xixi Qu; Long Chen; Tong Wu; Jiangping Ke; Kao Xiong; Mingyu Li; Haisheng Song; Wei Wei; Junkai Cao; Jianbing Zhang; Liang Gao; Jiang Tang is a Engineering article available to read on EtoBox.
What is A Near-infrared Colloidal Quantum Dot Imager with Monolithically Integrated Readout Circuitry about?
Imagers that operate in the near-infrared region (wavelengths of 0.7-1.4 μm) are of use in applications such as material sorting, machine vision and autonomous driving. However, such imagers typically use the flip-chip method to connect infrared photodiodes with silicon-based readout integrated circuits, as the need for high-temperature processing and single-crystalline substrates prevents direct integration. This increases processing complexity and cost. Here we report high-resolution imagers that monolithically integrate near-infrared colloidal quantum dot photodiodes with complementary metal-oxide-semiconductor readout integrated circuits. The colloidal quantum dot photodetector is designed with a structure compatible with complementary metal-oxide-semiconductors and exhibits a spectral range of 400-1,300 nm, room-temperature detectivity of 2.1 × 10 12 Jones, -3 dB bandwidth of 140 kHz and linear dynamic range of over 100 dB. With this approach, we create a large (640 × 512 pixels) imager that exhibits a spatial resolution of 40 line pairs per millimetre at a modulation transfer function of 50%, and we show that it can be used for vein imaging and matter identification.
Who reads A Near-infrared Colloidal Quantum Dot Imager with Monolithically Integrated Readout Circuitry?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Jing Liu; Peilin Liu; Dengyang Chen; Tailong Shi; Xixi Qu; Long Chen; Tong Wu; Jiangping Ke; Kao Xiong; Mingyu Li; Haisheng Song; Wei Wei; Junkai Cao; Jianbing Zhang; Liang Gao; Jiang Tang
- Publisher
- Springer Science and Business Media LLC
- Published
- 2022
- Language
- EN
- Field
- Engineering (Physical Sciences)