About this scholarly article

Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs by Kim, Dae Hyun ;Mukhopadhyay, Saibal ;Lim, Sung Kyu is a scholarly article available to read on EtoBox.

Author

Kim, Dae Hyun ;Mukhopadhyay, Saibal ;Lim, Sung Kyu

Publisher

ACM Press

Published

2009