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About this Engineering article
Mathematical model of a plated-through hole under a load induced by thermal mismatch : Boris A. Mirman. IEEE Trans. Comp. Hybrids Manufact. Tech. 11(4), 506 (December 1988) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 1990
- Field
- Engineering (Physical Sciences)