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About this scholarly article
2009 International Conference on Electronic Packaging Technology & High Density Packaging - Advanced package design for electronic and MEMS applications supported by fe analyses and deformation measurements by Sommer, J.-P.; Michel, B.; Kugler, A.; Rank, H. is a scholarly article available to read on EtoBox.
- Author
- Sommer, J.-P.; Michel, B.; Kugler, A.; Rank, H.
- Publisher
- IEEE
- Published
- 2009
- Language
- EN
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