About this scholarly article

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) - Development of reworkable underfills, materials, reliability and processing by Crane, L.; Torres-Filho, A.; Ober, C.K.; Yang, S.; Chen, J.-S.; Johnson, R.W. is a scholarly article available to read on EtoBox.

Author

Crane, L.; Torres-Filho, A.; Ober, C.K.; Yang, S.; Chen, J.-S.; Johnson, R.W.

Publisher

IEEE

Published

1998

Language

EN