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The Characteristics of Gettering Ability in Advanced Multi-Chip Packaging Thinned Wafer by An, J.-H.; Kim, J.-S.; Kim, J.-Y.; Lee, K.-S.; Kang, H.-B.; Moon, B.-S.; Lee, S.-H.; Shin, Y.; Hwang, S.-M.; Park, H.-Y. is a Engineering article available to read on EtoBox.
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- Author
- An, J.-H.; Kim, J.-S.; Kim, J.-Y.; Lee, K.-S.; Kang, H.-B.; Moon, B.-S.; Lee, S.-H.; Shin, Y.; Hwang, S.-M.; Park, H.-Y.
- Publisher
- The Electrochemical Society; Electrochemical Society, Inc. (ISSN 1938-6737)
- Published
- 2013
- Field
- Engineering (Physical Sciences)